Chemical content BZX884S-C2V4-Q

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Type numberPackagePackage descriptionTotal product weight
BZX884S-C2V4-QSOD882BDDFN1006-20.88940 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662770315112601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.62357
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22367
Phenolic resinProprietary0.0025713.530000.28904
DieDoped siliconSilicon (Si)7440-21-30.02800100.000003.14819
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.45784
Magnesium (Mg)7439-95-40.000590.150000.06662
Nickel (Ni)7440-02-00.011772.980001.32348
Silicon (Si)7440-21-30.002570.650000.28868
Pure metal layerGold (Au)7440-57-50.000040.010000.00444
Nickel (Ni)7440-02-00.002250.570000.25315
Palladium (Pd)7440-05-30.000160.040000.01776
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.79530
Silica fused60676-86-00.3387980.0920038.09188
PigmentCarbon black1333-86-40.003930.928000.44136
PolymerEpoxy resin systemProprietary0.035748.450004.01883
Phenolic resinProprietary0.010792.550001.21278
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00125
Tin solderTin (Sn)7440-31-50.0199999.940002.24736
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044099.990000.49467
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.