Chemical content BZX884S-C47-Q

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Type numberPackagePackage descriptionTotal product weight
BZX884S-C47-QSOD882BDDFN1006-20.90048 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662929315112601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.60359
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22092
Phenolic resinProprietary0.0025713.530000.28548
DieDoped siliconSilicon (Si)7440-21-30.03900100.000004.33102
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000041.93541
Magnesium (Mg)7439-95-40.000590.150000.06580
Nickel (Ni)7440-02-00.011772.980001.30719
Silicon (Si)7440-21-30.002570.650000.28513
Pure metal layerGold (Au)7440-57-50.000040.010000.00439
Nickel (Ni)7440-02-00.002250.570000.25003
Palladium (Pd)7440-05-30.000160.040000.01755
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.74860
Silica fused60676-86-00.3387980.0920037.62317
PigmentCarbon black1333-86-40.003930.928000.43593
PolymerEpoxy resin systemProprietary0.035748.450003.96938
Phenolic resinProprietary0.010792.550001.19786
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00123
Tin solderTin (Sn)7440-31-50.0199999.940002.21971
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044899.990000.49746
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.