Chemical content BZX8850S-C2V0-Q

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Type numberPackagePackage descriptionTotal product weight
BZX8850S-C2V0-QSOD882BDDFN1006-20.88997 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346633803152126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.62253
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22352
Phenolic resinProprietary0.0025713.530000.28885
DieDoped siliconSilicon (Si)7440-21-30.02841100.000003.19260
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.43064
Magnesium (Mg)7439-95-40.000590.150000.06658
Nickel (Ni)7440-02-00.011772.980001.32263
Silicon (Si)7440-21-30.002570.650000.28849
Pure metal layerGold (Au)7440-57-50.000040.010000.00444
Nickel (Ni)7440-02-00.002250.570000.25299
Palladium (Pd)7440-05-30.000160.040000.01775
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.79287
Silica fused60676-86-00.3387980.0920038.06748
PigmentCarbon black1333-86-40.003930.928000.44108
PolymerEpoxy resin systemProprietary0.035748.450004.01626
Phenolic resinProprietary0.010792.550001.21201
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00125
Tin solderTin (Sn)7440-31-50.0199999.940002.24592
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045699.990000.51233
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.