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Chemical content CBT3245ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
CBT3245ABQ-Q100SOT764-1DHVQFN2028.12223 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353004721151612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24290
PolymerResin systemProprietary0.0169719.900000.06035
subTotal0.08528100.000000.30325
DieDoped siliconSilicon (Si)7440-21-30.33762100.000001.20053
subTotal0.33762100.000001.20053
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.65333
Iron (Fe)7439-89-60.260732.400000.92714
Phosphorus (P)7723-14-00.003260.030000.01159
Zinc (Zn)7440-66-60.010860.100000.03863
subTotal10.86381100.0000038.63069
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69443
FillerSilica -amorphous-7631-86-90.571483.490002.03215
Silica fused60676-86-013.8892184.8200049.38871
PigmentCarbon black1333-86-40.026200.160000.09316
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62886
Epoxy resin systemProprietary0.260361.590000.92582
Phenolic resinProprietary0.368442.250001.31012
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.15442
subTotal16.37492100.0000058.22767
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00981
Nickel (Ni)7440-02-00.2509691.000000.89239
Palladium (Pd)7440-05-30.022068.000000.07845
subTotal0.27578100.000000.98065
WirePure metalGold (Au)7440-57-50.1829899.000000.65064
Palladium (Pd)7440-05-30.001851.000000.00657
subTotal0.18482100.000000.65721
total28.12223100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.