Chemical content HEF4001BT-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

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Type number	Package	Package description	Total product weight
HEF4001BT-Q100	SOT108-1	SO14	141.66239 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935300103118	9	1	260		1	235			Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.02337	77.90000	0.01650
	Polymer	Acrylic resin	Proprietary	0.00456	15.20000	0.00322
		Resin system	Proprietary	0.00207	6.90000	0.00146
		subTotal		0.03000	100.00000	0.02118

Die	Doped silicon	Silicon (Si)	7440-21-3	0.23294	100.00000	0.16443
		subTotal		0.23294	100.00000	0.16443

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	47.74804	97.47000	33.70552
		Iron (Fe)	7439-89-6	1.17570	2.40000	0.82993
		Phosphorus (P)	7723-14-0	0.01470	0.03000	0.01037
		Zinc (Zn)	7440-66-6	0.04899	0.10000	0.03458
		subTotal		48.98742	100.00000	34.58040

Mould Compound	Additive	Non hazardous	Proprietary	4.28097	4.70000	3.02195
	Filler	Silica fused	60676-86-0	71.95676	79.00000	50.79454
	Flame retardant	Magnesium Hydroxide (Mg(OH)2)	1309-42-8	5.46507	6.00000	3.85781
	Pigment	Carbon black	1333-86-4	0.18217	0.20000	0.12859
	Polymer	1,4-Bis(methoxymethyl)benzene/phenol copolymer	26834-02-6	3.64338	4.00000	2.57188
		Non hazardous	Proprietary	3.73446	4.10000	2.63617
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	1.82169	2.00000	1.28594
		subTotal		91.08450	100.00000	64.29688

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.03731	3.00000	0.02633
		Nickel (Ni)	7440-02-0	1.14778	92.30000	0.81022
		Palladium (Pd)	7440-05-3	0.03855	3.10000	0.02721
		Silver (Ag)	7440-22-4	0.01990	1.60000	0.01404
		subTotal		1.24353	100.00000	0.87780

Wire	Pure metal	Copper (Cu)	7440-50-8	0.08400	100.00000	0.05929
		subTotal		0.08400	100.00000	0.05929

		total		141.66239	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.