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Chemical content HEF4001BT

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Type numberPackagePackage descriptionTotal product weight
HEF4001BTSOT108-1SO14123.21694 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9333725906531412601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06322
PolymerAcrylic resinProprietary0.0152015.200000.01234
Resin systemProprietary0.006906.900000.00560
subTotal0.10000100.000000.08116
DieDoped siliconSilicon (Si)7440-21-30.23294100.000000.18905
subTotal0.23294100.000000.18905
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.23309
Iron (Fe)7439-89-61.068962.400000.86754
Phosphorus (P)7723-14-00.013360.030000.01084
Zinc (Zn)7440-66-60.044540.100000.03615
subTotal44.54000100.0000036.14762
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95960
FillerSilica fused60676-86-061.2961079.0000049.74649
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77821
PigmentCarbon black1333-86-40.155180.200000.12594
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51881
Non hazardousProprietary3.181194.100002.58178
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25940
subTotal77.59000100.0000062.97023
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00544
Nickel (Ni)7440-02-00.6499097.000000.52744
Palladium (Pd)7440-05-30.013402.000000.01088
subTotal0.67000100.000000.54376
WirePure metalCopper (Cu)7440-50-80.08400100.000000.06817
subTotal0.08400100.000000.06817
total123.21694100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.