Chemical content HEF4052BTT-Q100

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Type numberPackagePackage descriptionTotal product weight
HEF4052BTT-Q100SOT403-1TSSOP1661.03295 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352985231181012601235Jiangyin, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21698
PolymerAcrylic resinProprietary0.0258415.200000.04234
Resin systemProprietary0.011736.900000.01922
DieDoped siliconSilicon (Si)7440-21-30.83051100.000001.36075
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.64385
Iron (Fe)7439-89-60.475552.400000.77917
Phosphorus (P)7723-14-00.005940.030000.00974
Zinc (Zn)7440-66-60.019810.100000.03247
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.38930
Silica fused60676-86-031.0186878.3300050.82284
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.95786
PigmentCarbon black1333-86-40.079200.200000.12977
PolymerEpoxy resin systemProprietary3.509358.862005.74993
Phenolic resinProprietary2.339575.908003.83329
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02472
Nickel (Ni)7440-02-00.4642592.300000.76066
Palladium (Pd)7440-05-30.015593.100000.02555
Silver (Ag)7440-22-40.008051.600000.01319
WirePure metalCopper (Cu)7440-50-80.11499100.000000.18840
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.