Chemical content HEF4060BT-Q100

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Download chemical content (.PDF)

Type number	Package	Package description	Total product weight
HEF4060BT-Q100	SOT109-1	SO16	144.56248 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935300107118	7	1	260	30 s	1	235	20 s	3	Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.85690	77.90000	0.59275
	Polymer	Acrylic resin	Proprietary	0.16720	15.20000	0.11566
		Resin system	Proprietary	0.07590	6.90000	0.05250
		subTotal		1.10000	100.00000	0.76091

Die	Doped silicon	Silicon (Si)	7440-21-3	0.67686	100.00000	0.46822
		subTotal		0.67686	100.00000	0.46822

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	50.68440	97.47000	35.06055
		Iron (Fe)	7439-89-6	1.24800	2.40000	0.86329
		Phosphorus (P)	7723-14-0	0.01560	0.03000	0.01079
		Zinc (Zn)	7440-66-6	0.05200	0.10000	0.03597
		subTotal		52.00000	100.00000	35.97060

Mould Compound	Additive	Non hazardous	Proprietary	4.25209	4.70000	2.94135
	Filler	Silica fused	60676-86-0	71.47130	79.00000	49.43973
	Flame retardant	Magnesium Hydroxide (Mg(OH)2)	1309-42-8	5.42820	6.00000	3.75492
	Pigment	Carbon black	1333-86-4	0.18094	0.20000	0.12516
	Polymer	1,4-Bis(methoxymethyl)benzene/phenol copolymer	26834-02-6	3.61880	4.00000	2.50328
		Non hazardous	Proprietary	3.70927	4.10000	2.56586
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	1.80940	2.00000	1.25164
		subTotal		90.47000	100.00000	62.58194

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.00600	3.00000	0.00415
		Nickel (Ni)	7440-02-0	0.18460	92.30000	0.12770
		Palladium (Pd)	7440-05-3	0.00620	3.10000	0.00429
		Silver (Ag)	7440-22-4	0.00320	1.60000	0.00221
		subTotal		0.20000	100.00000	0.13835

Wire	Pure metal	Copper (Cu)	7440-50-8	0.11562	100.00000	0.07998
		subTotal		0.11562	100.00000	0.07998

		total		144.56248	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.