Chemical content HEF4060BT-Q100

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Type numberPackagePackage descriptionTotal product weight
HEF4060BT-Q100SOT109-1SO16162.31884 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300107118812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00960
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
DieDoped siliconSilicon (Si)7440-21-30.48348100.000000.29786
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.65606
Iron (Fe)7439-89-61.345162.400000.82871
Phosphorus (P)7723-14-00.016810.030000.01036
Zinc (Zn)7440-66-60.056050.100000.03453
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38534
Silica fused60676-86-081.6566878.3300050.30634
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.91764
PigmentCarbon black1333-86-40.208490.200000.12845
PolymerEpoxy resin systemProprietary9.238378.862005.69150
Phenolic resinProprietary6.158915.908003.79433
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02630
Nickel (Ni)7440-02-01.3132192.300000.80903
Palladium (Pd)7440-05-30.044113.100000.02717
Silver (Ag)7440-22-40.022761.600000.01402
WirePure metalCopper (Cu)7440-50-80.09746100.000000.06004
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.