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Chemical content HEF4077BT

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Type numberPackagePackage descriptionTotal product weight
HEF4077BTSOT108-1SO14136.61451 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9333730706531012601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.46580
PolymerResin systemProprietary0.4975019.900000.36416
subTotal2.50000100.000001.82996
DieDoped siliconSilicon (Si)7440-21-30.73917100.000000.54106
subTotal0.73917100.000000.54106
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.37538
Iron (Fe)7439-89-61.560002.400001.14190
Phosphorus (P)7723-14-00.019500.030000.01427
Zinc (Zn)7440-66-60.065000.100000.04758
subTotal65.00000100.0000047.57913
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.33943
FillerSilica fused60676-86-053.7200079.0000039.32232
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.98651
PigmentCarbon black1333-86-40.136000.200000.09955
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.99100
Non hazardousProprietary2.788004.100002.04078
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.99550
subTotal68.00000100.0000049.77509
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00220
Nickel (Ni)7440-02-00.2910097.000000.21301
Palladium (Pd)7440-05-30.006002.000000.00439
subTotal0.30000100.000000.21960
WirePure metalCopper (Cu)7440-50-80.07534100.000000.05515
subTotal0.07534100.000000.05515
total136.61451100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.