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Chemical content HEF4081BT

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Type numberPackagePackage descriptionTotal product weight
HEF4081BTSOT108-1SO14123.31125 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9333730906531412601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06317
PolymerAcrylic resinProprietary0.0152015.200000.01233
Resin systemProprietary0.006906.900000.00560
subTotal0.10000100.000000.08110
DieDoped siliconSilicon (Si)7440-21-30.33155100.000000.26887
subTotal0.33155100.000000.26887
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.20615
Iron (Fe)7439-89-61.068962.400000.86688
Phosphorus (P)7723-14-00.013360.030000.01084
Zinc (Zn)7440-66-60.044540.100000.03612
subTotal44.54000100.0000036.11999
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95734
FillerSilica fused60676-86-061.2961079.0000049.70844
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77532
PigmentCarbon black1333-86-40.155180.200000.12584
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51688
Non hazardousProprietary3.181194.100002.57981
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25844
subTotal77.59000100.0000062.92207
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00543
Nickel (Ni)7440-02-00.6499097.000000.52704
Palladium (Pd)7440-05-30.013402.000000.01087
subTotal0.67000100.000000.54334
WirePure metalCopper (Cu)7440-50-80.07970100.000000.06463
subTotal0.07970100.000000.06463
total123.31125100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.