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Chemical content HEF4094BT

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Type numberPackagePackage descriptionTotal product weight
HEF4094BTSOT109-1SO16137.56900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9334066606531512601235Jiangyin, China; Suzhou, China; Jiangsu, China; Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1311577.900000.09534
PolymerAcrylic resinProprietary0.0255915.200000.01860
Resin systemProprietary0.011626.900000.00844
subTotal0.16836100.000000.12238
DieDoped siliconSilicon (Si)7440-21-30.44746100.000000.32527
subTotal0.44746100.000000.32527
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-848.6504297.4700035.36437
Iron (Fe)7439-89-61.197922.400000.87078
Phosphorus (P)7723-14-00.014970.030000.01088
Zinc (Zn)7440-66-60.049910.100000.03628
subTotal49.91322100.0000036.28231
Mould CompoundFillerSilica -amorphous-7631-86-90.513970.600000.37361
Silica fused60676-86-067.0991478.3300048.77490
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.225396.100003.79838
PigmentCarbon black1333-86-40.171320.200000.12454
PolymerEpoxy resin systemProprietary7.591388.862005.51823
Phenolic resinProprietary5.060925.908003.67882
subTotal85.66212100.0000062.26848
Pre-PlatingPure metal layerGold (Au)7440-57-50.012791.000000.00930
Nickel (Ni)7440-02-01.2408897.000000.90201
Palladium (Pd)7440-05-30.025592.000000.01860
subTotal1.27926100.000000.92991
WirePure metalCopper (Cu)7440-50-80.09858100.000000.07166
subTotal0.09858100.000000.07166
total137.56900100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.