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Chemical content HEF4521BT

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Type numberPackagePackage descriptionTotal product weight
HEF4521BTSOT109-1SO16155.93467 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9334067706531112601235Bangkok, Thailand; Suzhou, China; Nijmegen, NetherlandsLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2726577.900000.17485
PolymerAcrylic resinProprietary0.0532015.200000.03412
Resin systemProprietary0.024156.900000.01549
subTotal0.35000100.000000.22446
DieDoped siliconSilicon (Si)7440-21-32.13917100.000001.37184
subTotal2.13917100.000001.37184
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6806797.4700035.06640
Iron (Fe)7439-89-61.346402.400000.86344
Phosphorus (P)7723-14-00.016830.030000.01079
Zinc (Zn)7440-66-60.056100.100000.03598
subTotal56.10000100.0000035.97661
Mould CompoundAdditiveNon hazardousProprietary4.535834.700002.90880
FillerSilica fused60676-86-076.2405379.0000048.89261
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.790426.000003.71336
PigmentCarbon black1333-86-40.193010.200000.12378
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.860284.000002.47558
Non hazardousProprietary3.956794.100002.53746
Tetramethylbiphenyl diglycidyl ether85954-11-61.930142.000001.23779
subTotal96.50700100.0000061.88938
Pre-PlatingPure metal layerGold (Au)7440-57-50.022773.000000.01460
Nickel (Ni)7440-02-00.7005692.300000.44926
Palladium (Pd)7440-05-30.023533.100000.01509
Silver (Ag)7440-22-40.012141.600000.00779
subTotal0.75900100.000000.48674
WirePure metalCopper (Cu)7440-50-80.07950100.000000.05098
subTotal0.07950100.000000.05098
total155.93467100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.