Chemical content HEF4894BTT-Q100

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Type numberPackagePackage descriptionTotal product weight
HEF4894BTT-Q100SOT360-1TSSOP2083.98689 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352985261181012601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03710
PolymerAcrylic resinProprietary0.0060815.200000.00724
Resin systemProprietary0.002766.900000.00329
DieDoped siliconSilicon (Si)7440-21-31.01684100.000001.21071
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.47537
Iron (Fe)7439-89-60.733632.400000.87351
Phosphorus (P)7723-14-00.009170.030000.01092
Zinc (Zn)7440-66-60.030570.100000.03640
Mould CompoundFillerSilica -amorphous-7631-86-90.308880.600000.36777
Silica fused60676-86-040.3242878.3300048.01259
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.140286.100003.73901
PigmentCarbon black1333-86-40.102960.200000.12259
PolymerEpoxy resin systemProprietary4.562168.862005.43199
Phenolic resinProprietary3.041445.908003.62133
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02772
Nickel (Ni)7440-02-00.7162192.300000.85277
Palladium (Pd)7440-05-30.024053.100000.02864
Silver (Ag)7440-22-40.012421.600000.01478
WirePure metalCopper (Cu)7440-50-80.10607100.000000.12629
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.