Chemical content HPZR-C18-Q

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Type numberPackagePackage descriptionTotal product weight
HPZR-C18-QSOD123WSOD217.29000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664758115212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.78000100.000004.51128
ClipCopper alloyCopper (Cu)7440-50-83.1752399.8500018.36455
Iron (Fe)7439-89-60.003820.120000.02207
Phosphorus (P)7723-14-00.000950.030000.00552
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100031.32257
Iron (Fe)7439-89-60.005520.100000.03193
Phosphorus (P)7723-14-00.001660.030000.00958
Pure metal layerSilver (Ag)7440-22-40.097151.760000.56190
Mould CompoundFillerSilica -amorphous-7631-86-90.6680010.000003.86350
Silica fused60676-86-05.0100075.0000028.97629
PigmentCarbon black1333-86-40.020040.300000.11591
PolymerEpoxy resin systemProprietary0.514367.700002.97490
Phenolic resinProprietary0.467607.000002.70445
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00005
Tin solderTin (Sn)7440-31-50.1599899.990000.92530
Solder PasteLead alloyLead (Pb)7439-92-10.8972592.500005.18942
Silver alloySilver (Ag)7440-22-40.024252.500000.14025
Tin alloyTin (Sn)7440-31-50.048505.000000.28051
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.