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Chemical content LSF0204GU12-Q100

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Type numberPackagePackage descriptionTotal product weight
LSF0204GU12-Q100SOT1174-1XQFN124.36256 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691321115412601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0173860.000000.39830
ImpurityNon hazardousProprietary0.000010.039500.00026
PolymerResin systemProprietary0.0115739.951410.26521
subTotal0.02896100.000000.66377
DieDoped siliconSilicon (Si)7440-21-30.16021100.000003.67240
subTotal0.16021100.000003.67240
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.1318697.0000048.86709
Nickel (Ni)7440-02-00.065933.000001.51135
subTotal2.19779100.0000050.37844
Mould CompoundAdditiveNon hazardousProprietary0.052062.900001.19331
FillerSilica fused60676-86-01.5967888.9500036.60184
PigmentCarbon black1333-86-40.002690.150000.06172
PolymerEpoxy resin systemProprietary0.026391.470000.60489
Phenolic resinProprietary0.055833.110001.27973
Tetramethylbiphenyl diglycidyl ether85954-11-60.061393.420001.40729
subTotal1.79514100.0000041.14878
Pre-PlatingPure metal layerGold (Au)7440-57-50.001181.000000.02707
Nickel (Ni)7440-02-00.1074891.000002.46369
Palladium (Pd)7440-05-30.009458.000000.21659
subTotal0.11811100.000002.70735
WirePure metalGold (Au)7440-57-50.0617299.000001.41482
Palladium (Pd)7440-05-30.000621.000000.01429
subTotal0.06235100.000001.42911
total4.36256100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.