Chemical content MJD31CH-Q

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Type numberPackagePackage descriptionTotal product weight
MJD31CH-QSOT428CDPAK316.50555 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346628471183126030 sNA23520 s3Nantong, China; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.56000100.000000.17693
Lead FrameCopper alloyCopper (Cu)7440-50-8173.9541599.8646054.96085
Tin (Sn)7440-31-50.231670.133000.07320
Pure metal layerNickel (Ni)7440-02-00.004180.002400.00132
Mould CompoundFillerSilica fused60676-86-0121.4167588.9500038.36165
PigmentCarbon black1333-86-40.750750.550000.23720
PolymerEpoxy resin systemProprietary10.237507.500003.23454
Phenolic resinProprietary4.095003.000001.29382
Post-PlatingImpurityNon hazardousProprietary0.000030.000900.00001
Tin solderTin (Sn)7440-31-53.2599799.999101.02999
Solder WireLead alloyLead (Pb)7439-92-11.7285595.500000.54614
Silver (Ag)7440-22-40.045252.500000.01430
Tin (Sn)7440-31-50.036202.000000.01144
WireImpurityNon hazardousProprietary0.000020.010000.00001
Pure metalAluminium (Al)7429-90-50.1855399.990000.05862
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.