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Chemical content MJD42C

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Type numberPackagePackage descriptionTotal product weight
MJD42CSOT428CDPAK316.77313 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662265118112601235D-22529 HAMBURG, Germany; Nantong, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.98000100.000000.30937
subTotal0.98000100.000000.30937
Lead FrameCopper alloyCopper (Cu)7440-50-8173.9541599.8646054.91443
Tin (Sn)7440-31-50.231670.133000.07314
Pure metal layerNickel (Ni)7440-02-00.004180.002400.00132
subTotal174.19000100.0000054.98889
Mould CompoundFillerSilica fused60676-86-0121.4167588.9500038.32925
PigmentCarbon black1333-86-40.750750.550000.23700
PolymerEpoxy resin systemProprietary10.237507.500003.23181
Phenolic resinProprietary4.095003.000001.29272
subTotal136.50000100.0000043.09078
Post-PlatingImpurityNon hazardousProprietary0.000030.000900.00001
Tin solderTin (Sn)7440-31-53.2599799.999101.02912
subTotal3.26000100.000001.02913
Solder WireLead alloyLead (Pb)7439-92-11.7285595.500000.54567
Silver (Ag)7440-22-40.045252.500000.01428
Tin (Sn)7440-31-50.036202.000000.01143
subTotal1.81000100.000000.57138
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalAluminium (Al)7429-90-50.0331399.990000.01046
subTotal0.03313100.000000.01046
total316.77313100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.