Chemical content MJD45H11A

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Type numberPackagePackage descriptionTotal product weight
MJD45H11ASOT428CDPAK316.84314 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346605521184126030 s123520 s3Nantong, China; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.05000100.000000.33139
Lead FrameCopper alloyCopper (Cu)7440-50-8173.9541599.8646054.90229
Tin (Sn)7440-31-50.231670.133000.07312
Pure metal layerNickel (Ni)7440-02-00.004180.002400.00132
Mould CompoundFillerSilica fused60676-86-0121.4167588.9500038.32078
PigmentCarbon black1333-86-40.750750.550000.23695
PolymerEpoxy resin systemProprietary10.237507.500003.23109
Phenolic resinProprietary4.095003.000001.29244
Post-PlatingImpurityNon hazardousProprietary0.000030.000900.00001
Tin solderTin (Sn)7440-31-53.2599799.999101.02889
Solder WireLead alloyLead (Pb)7439-92-11.7285595.500000.54555
Silver (Ag)7440-22-40.045252.500000.01428
Tin (Sn)7440-31-50.036202.000000.01143
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalAluminium (Al)7429-90-50.0331399.990000.01046
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.