Chemical content NHUMB9

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Type numberPackagePackage descriptionTotal product weight
NHUMB9SOT363SC-885.47627 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346614191351126030 s123520 s3Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
9346614191151126030 s123520 s3D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10800100.000001.97215
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03402
Carbon (C)7440-44-00.000830.040000.01512
Chromium (Cr)7440-47-30.004350.210000.07938
Cobalt (Co)7440-48-40.008900.430000.16254
Iron (Fe)7439-89-60.9811847.4000017.91694
Manganese (Mn)7439-96-50.017600.850000.32130
Nickel (Ni)7440-02-00.7392035.7100013.49818
Phosphorus (P)7723-14-00.000410.020000.00756
Silicon (Si)7440-21-30.005380.260000.09828
Sulphur (S)7704-34-90.000410.020000.00756
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.95551
Silver (Ag)7440-22-40.038501.860000.70307
Mould CompoundFillerSilica fused60676-86-02.1929275.1000040.04404
PigmentCarbon black1333-86-40.008760.300000.15996
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.33117
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.78579
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.75575
WirePure metalCopper (Cu)7440-50-80.00827100.000000.15101
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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