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Chemical content NXB0102DC-Q100

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Type numberPackagePackage descriptionTotal product weight
NXB0102DC-Q100SOT765-1VSSOP810.07838 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691056125612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28485
PolymerResin systemProprietary0.0071319.900000.07077
subTotal0.03584100.000000.35562
DieDoped siliconSilicon (Si)7440-21-30.22526100.000002.23510
subTotal0.22526100.000002.23510
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000033.72120
Nickel (Ni)7440-02-00.105113.000001.04292
subTotal3.50366100.0000034.76412
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.88308
FillerSilica fused60676-86-04.8840279.0000048.46034
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.68053
PigmentCarbon black1333-86-40.012360.200000.12268
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.45369
Non hazardousProprietary0.253474.100002.51503
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.22684
subTotal6.18230100.0000061.34219
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03064
Nickel (Ni)7440-02-00.0950292.300000.94284
Palladium (Pd)7440-05-30.003193.100000.03167
Silver (Ag)7440-22-40.001651.600000.01634
subTotal0.10295100.000001.02149
WirePure metalCopper (Cu)7440-50-80.02837100.000000.28150
subTotal0.02837100.000000.28150
total10.07838100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.