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Chemical content NXB0104BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
NXB0104BQ-Q100SOT762-1DHVQFN1418.24627 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690881115612601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10211
PolymerResin systemProprietary0.0046319.900000.02537
subTotal0.02326100.000000.12748
DieDoped siliconSilicon (Si)7440-21-30.50476100.000002.76636
subTotal0.50476100.000002.76636
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8028397.4700037.28341
Iron (Fe)7439-89-60.167512.400000.91803
Phosphorus (P)7723-14-00.002090.030000.01148
Zinc (Zn)7440-66-60.006980.100000.03825
subTotal6.97941100.0000038.25117
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.67778
FillerSilica -amorphous-7631-86-90.367153.490002.01218
Silica fused60676-86-08.9230784.8200048.90354
PigmentCarbon black1333-86-40.016830.160000.09225
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62268
Epoxy resin systemProprietary0.167271.590000.91673
Phenolic resinProprietary0.236702.250001.29725
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.13326
subTotal10.52001100.0000057.65567
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00971
Nickel (Ni)7440-02-00.1612391.000000.88365
Palladium (Pd)7440-05-30.014178.000000.07768
subTotal0.17718100.000000.97104
WirePure metalCopper (Cu)7440-50-80.0402296.550000.22042
Pure metal layerGold (Au)7440-57-50.000150.350000.00080
Palladium (Pd)7440-05-30.001293.100000.00708
subTotal0.04166100.000000.22830
total18.24627100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.