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Chemical content NXB0104GU12-Q100

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Type numberPackagePackage descriptionTotal product weight
NXB0104GU12-Q100SOT1174-1XQFN124.57996 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691323115412601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0173860.000000.37939
ImpurityNon hazardousProprietary0.000010.039500.00025
PolymerResin systemProprietary0.0115739.951410.25262
subTotal0.02896100.000000.63226
DieDoped siliconSilicon (Si)7440-21-30.37857100.000008.26575
subTotal0.37857100.000008.26575
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.1318697.0000046.54749
Nickel (Ni)7440-02-00.065933.000001.43961
subTotal2.19779100.0000047.98710
Mould CompoundAdditiveNon hazardousProprietary0.052062.900001.13667
FillerSilica fused60676-86-01.5967888.9500034.86443
PigmentCarbon black1333-86-40.002690.150000.05879
PolymerEpoxy resin systemProprietary0.026391.470000.57617
Phenolic resinProprietary0.055833.110001.21898
Tetramethylbiphenyl diglycidyl ether85954-11-60.061393.420001.34049
subTotal1.79514100.0000039.19553
Pre-PlatingPure metal layerGold (Au)7440-57-50.001181.000000.02579
Nickel (Ni)7440-02-00.1074891.000002.34675
Palladium (Pd)7440-05-30.009458.000000.20631
subTotal0.11811100.000002.57885
WirePure metalGold (Au)7440-57-50.0607899.000001.32704
Palladium (Pd)7440-05-30.000611.000000.01340
subTotal0.06139100.000001.34044
total4.57996100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.