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Chemical content NXB0104GU12

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Type numberPackagePackage descriptionTotal product weight
NXB0104GU12SOT1174-1XQFN124.45377 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690878115512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0173860.000000.39014
ImpurityNon hazardousProprietary0.000010.039500.00026
PolymerResin systemProprietary0.0115739.951410.25978
subTotal0.02896100.000000.65018
DieDoped siliconSilicon (Si)7440-21-30.25238100.000005.66663
subTotal0.25238100.000005.66663
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.1318697.0000047.86633
Nickel (Ni)7440-02-00.065933.000001.48040
subTotal2.19779100.0000049.34673
Mould CompoundAdditiveNon hazardousProprietary0.052062.900001.16888
FillerSilica fused60676-86-01.5967888.9500035.85226
PigmentCarbon black1333-86-40.002690.150000.06046
PolymerEpoxy resin systemProprietary0.026391.470000.59250
Phenolic resinProprietary0.055833.110001.25352
Tetramethylbiphenyl diglycidyl ether85954-11-60.061393.420001.37847
subTotal1.79514100.0000040.30609
Pre-PlatingPure metal layerGold (Au)7440-57-50.001181.000000.02652
Nickel (Ni)7440-02-00.1074891.000002.41324
Palladium (Pd)7440-05-30.009458.000000.21215
subTotal0.11811100.000002.65191
WirePure metalGold (Au)7440-57-50.0607899.000001.36464
Palladium (Pd)7440-05-30.000611.000000.01378
subTotal0.06139100.000001.37842
total4.45377100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.