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Chemical content NXS0102DC-Q100

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Type numberPackagePackage descriptionTotal product weight
NXS0102DC-Q100SOT765-1VSSOP810.15347 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691055125512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28274
PolymerResin systemProprietary0.0071319.900000.07024
subTotal0.03584100.000000.35298
DieDoped siliconSilicon (Si)7440-21-30.30035100.000002.95809
subTotal0.30035100.000002.95809
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000033.47181
Nickel (Ni)7440-02-00.105113.000001.03521
subTotal3.50366100.0000034.50702
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.86176
FillerSilica fused60676-86-04.8840279.0000048.10195
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.65331
PigmentCarbon black1333-86-40.012360.200000.12178
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.43554
Non hazardousProprietary0.253474.100002.49643
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.21777
subTotal6.18230100.0000060.88854
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03042
Nickel (Ni)7440-02-00.0950292.300000.93587
Palladium (Pd)7440-05-30.003193.100000.03143
Silver (Ag)7440-22-40.001651.600000.01622
subTotal0.10295100.000001.01394
WirePure metalCopper (Cu)7440-50-80.02837100.000000.27942
subTotal0.02837100.000000.27942
total10.15347100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.