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Chemical content NXS0104GU12-Q100

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Type numberPackagePackage descriptionTotal product weight
NXS0104GU12-Q100SOT1174-1XQFN124.53256 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691322115412601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0173860.000000.38336
ImpurityNon hazardousProprietary0.000010.039500.00025
PolymerResin systemProprietary0.0115739.951410.25526
subTotal0.02896100.000000.63887
DieDoped siliconSilicon (Si)7440-21-30.33255100.000007.33690
subTotal0.33255100.000007.33690
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.1318697.0000047.03427
Nickel (Ni)7440-02-00.065933.000001.45467
subTotal2.19779100.0000048.48894
Mould CompoundAdditiveNon hazardousProprietary0.052062.900001.14856
FillerSilica fused60676-86-01.5967888.9500035.22903
PigmentCarbon black1333-86-40.002690.150000.05941
PolymerEpoxy resin systemProprietary0.026391.470000.58220
Phenolic resinProprietary0.055833.110001.23173
Tetramethylbiphenyl diglycidyl ether85954-11-60.061393.420001.35451
subTotal1.79514100.0000039.60544
Pre-PlatingPure metal layerGold (Au)7440-57-50.001181.000000.02606
Nickel (Ni)7440-02-00.1074891.000002.37129
Palladium (Pd)7440-05-30.009458.000000.20846
subTotal0.11811100.000002.60581
WirePure metalGold (Au)7440-57-50.0594199.000001.31065
Palladium (Pd)7440-05-30.000601.000000.01324
subTotal0.06001100.000001.32389
total4.53256100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.