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Chemical content NXS0104GU12

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Type numberPackagePackage descriptionTotal product weight
NXS0104GU12SOT1174-1XQFN124.42171 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690693115712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0173860.000000.39297
ImpurityNon hazardousProprietary0.000010.039500.00026
PolymerResin systemProprietary0.0115739.951410.26166
subTotal0.02896100.000000.65489
DieDoped siliconSilicon (Si)7440-21-30.22170100.000005.01389
subTotal0.22170100.000005.01389
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.1318697.0000048.21339
Nickel (Ni)7440-02-00.065933.000001.49114
subTotal2.19779100.0000049.70453
Mould CompoundAdditiveNon hazardousProprietary0.052062.900001.17735
FillerSilica fused60676-86-01.5967888.9500036.11221
PigmentCarbon black1333-86-40.002690.150000.06090
PolymerEpoxy resin systemProprietary0.026391.470000.59680
Phenolic resinProprietary0.055833.110001.26261
Tetramethylbiphenyl diglycidyl ether85954-11-60.061393.420001.38846
subTotal1.79514100.0000040.59833
Pre-PlatingPure metal layerGold (Au)7440-57-50.001181.000000.02671
Nickel (Ni)7440-02-00.1074891.000002.43074
Palladium (Pd)7440-05-30.009458.000000.21369
subTotal0.11811100.000002.67114
WirePure metalGold (Au)7440-57-50.0594199.000001.34351
Palladium (Pd)7440-05-30.000601.000000.01357
subTotal0.06001100.000001.35708
total4.42171100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.