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Chemical content NXS0506GU

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Type numberPackagePackage descriptionTotal product weight
NXS0506GUSOT1161-1XQFN166.12236 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691516115312601235Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0110760.000000.18081
ImpurityNon hazardousProprietary0.000010.039500.00012
PolymerResin systemProprietary0.0073739.951410.12040
subTotal0.01845100.000000.30133
DieDoped siliconSilicon (Si)7440-21-30.43920100.000007.17379
subTotal0.43920100.000007.17379
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.8044297.0000045.80612
Nickel (Ni)7440-02-00.086733.000001.41668
subTotal2.89115100.0000047.22280
Mould CompoundAdditiveNon hazardousProprietary0.073232.900001.19604
FillerSilica fused60676-86-02.2460188.9500036.68543
PigmentCarbon black1333-86-40.003790.150000.06186
PolymerEpoxy resin systemProprietary0.037121.470000.60627
Phenolic resinProprietary0.078533.110001.28265
Tetramethylbiphenyl diglycidyl ether85954-11-60.086363.420001.41050
subTotal2.52503100.0000041.24275
Pre-PlatingPure metal layerGold (Au)7440-57-50.001551.000000.02538
Nickel (Ni)7440-02-00.1413991.000002.30935
Palladium (Pd)7440-05-30.012438.000000.20302
subTotal0.15537100.000002.53775
WirePure metalGold (Au)7440-57-50.0922299.000001.50635
Palladium (Pd)7440-05-30.000931.000000.01522
subTotal0.09316100.000001.52157
total6.12236100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.