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Chemical content PBHV8115X

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Type numberPackagePackage descriptionTotal product weight
PBHV8115XSOT89MPT345.13419 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340614211151112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.63090
PolymerResin systemProprietary0.0502515.000000.11133
subTotal0.33500100.000000.74223
DieDoped siliconSilicon (Si)7440-21-30.44000100.000000.97487
subTotal0.44000100.000000.97487
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100038.49825
Iron (Fe)7439-89-60.026220.150000.05809
Phosphorus (P)7723-14-00.006990.040000.01549
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15491
subTotal17.47900100.0000038.72674
Mould CompoundFillerSilica -amorphous-7631-86-92.087417.980004.62489
Silica fused60676-86-020.9504780.0920046.41817
PigmentCarbon black1333-86-40.242750.928000.53783
PolymerEpoxy resin systemProprietary2.210358.450004.89729
Phenolic resinProprietary0.667032.550001.47788
subTotal26.15800100.0000057.95606
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00087
Tin solderTin (Sn)7440-31-50.7075899.940001.56771
subTotal0.70800100.000001.56865
WirePure metalCopper (Cu)7440-50-80.01419100.000000.03144
subTotal0.01419100.000000.03144
total45.13419100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.