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Chemical content PBHV8115Z

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Type numberPackagePackage descriptionTotal product weight
PBHV8115ZSOT223SC-73102.74643 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340614111151212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1001077.000000.09742
PolymerResin systemProprietary0.0299023.000000.02910
subTotal0.13000100.000000.12652
DieDoped siliconSilicon (Si)7440-21-30.44000100.000000.42824
subTotal0.44000100.000000.42824
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500049.36925
Iron (Fe)7439-89-60.051160.100000.04979
Phosphorus (P)7723-14-00.015350.030000.01494
Pure metal layerSilver (Ag)7440-22-40.368350.720000.35851
subTotal51.16000100.0000049.79249
Mould CompoundAdditiveNon hazardousProprietary1.414912.900001.37709
Triphenylphosphine603-35-00.024400.050000.02374
FillerSilica -amorphous-7631-86-935.1288072.0000034.18980
PigmentCarbon black1333-86-40.024400.050000.02374
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-27.3185015.000007.12288
Phenol Formaldehyde resin (generic)9003-35-44.8790010.000004.74858
subTotal48.79000100.0000047.48583
Post-PlatingImpurityLead (Pb)7439-92-10.000100.004500.00010
Non hazardousProprietary0.001230.055500.00119
Tin solderTin (Sn)7440-31-52.2086799.940002.14964
subTotal2.21000100.000002.15093
WirePure metalCopper (Cu)7440-50-80.01643100.000000.01599
subTotal0.01643100.000000.01599
total102.74643100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.