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Chemical content PBHV9040X

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Type numberPackagePackage descriptionTotal product weight
PBHV9040XSOT89MPT344.95219 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340614191151212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.63345
PolymerResin systemProprietary0.0502515.000000.11179
subTotal0.33500100.000000.74524
DieDoped siliconSilicon (Si)7440-21-30.39000100.000000.86759
subTotal0.39000100.000000.86759
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100038.65412
Iron (Fe)7439-89-60.026220.150000.05833
Phosphorus (P)7723-14-00.006990.040000.01555
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15553
subTotal17.47900100.0000038.88353
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23738
FillerSilica -amorphous-7631-86-90.075480.290000.16790
Silica fused60676-86-022.4214086.1500049.87832
HardenerPhenolic resinProprietary1.116524.290002.48378
PigmentCarbon black1333-86-40.049450.190000.11000
PolymerEpoxy resin systemProprietary2.256458.670005.01968
subTotal26.02600100.0000057.89706
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00087
Tin solderTin (Sn)7440-31-50.7075899.940001.57406
subTotal0.70800100.000001.57500
WirePure metalCopper (Cu)7440-50-80.01419100.000000.03157
subTotal0.01419100.000000.03157
total44.95219100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.