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Chemical content PBHV9540X

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Type numberPackagePackage descriptionTotal product weight
PBHV9540XSOT89MPT345.17694 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071211135612601235Dongguan, China; D-22529 HAMBURG, Germany 
934071211115612601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.63030
PolymerResin systemProprietary0.0502515.000000.11123
subTotal0.33500100.000000.74153
DieDoped siliconSilicon (Si)7440-21-30.62000100.000001.37238
subTotal0.62000100.000001.37238
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100038.46182
Iron (Fe)7439-89-60.026220.150000.05804
Phosphorus (P)7723-14-00.006990.040000.01548
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15476
subTotal17.47900100.0000038.69010
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23620
FillerSilica -amorphous-7631-86-90.075480.290000.16707
Silica fused60676-86-022.4214086.1500049.63019
HardenerPhenolic resinProprietary1.116524.290002.47143
PigmentCarbon black1333-86-40.049450.190000.10946
PolymerEpoxy resin systemProprietary2.256458.670004.99470
subTotal26.02600100.0000057.60905
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00087
Tin solderTin (Sn)7440-31-50.7075899.940001.56623
subTotal0.70800100.000001.56717
WirePure metalCopper (Cu)7440-50-80.00894100.000000.01979
subTotal0.00894100.000000.01979
total45.17694100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.