Chemical content PBSS306PX

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Type numberPackagePackage descriptionTotal product weight
PBSS306PXSOT89MPT345.93438 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93405901911513126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.61991
PolymerResin systemProprietary0.0502515.000000.10940
DieDoped siliconSilicon (Si)7440-21-31.27000100.000002.76481
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100037.82760
Iron (Fe)7439-89-60.026220.150000.05708
Phosphorus (P)7723-14-00.006990.040000.01522
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15221
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23230
FillerSilica -amorphous-7631-86-90.075480.290000.16431
Silica fused60676-86-022.4214086.1500048.81180
HardenerPhenolic resinProprietary1.116524.290002.43067
PigmentCarbon black1333-86-40.049450.190000.10765
PolymerEpoxy resin systemProprietary2.256458.670004.91234
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00086
Tin solderTin (Sn)7440-31-50.7075899.940001.54040
WireImpurityNon hazardousProprietary0.000010.010000.00003
Pure metalCopper (Cu)7440-50-80.1163699.990000.25333
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.