Chemical content PBSS3515MB

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Type numberPackagePackage descriptionTotal product weight
PBSS3515MBSOT883BXQFN30.69886 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340658773154126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32625
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04494
Phenolic resinProprietary0.0004113.530000.05808
DieDoped siliconSilicon (Si)7440-21-30.05000100.000007.15451
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09616
Copper (Cu)7440-50-80.2632094.0000037.66133
Tin (Sn)7440-31-50.000670.240000.09616
Zinc (Zn)7440-66-60.000590.210000.08414
Pure metal layerGold (Au)7440-57-50.000220.080000.03205
Nickel (Ni)7440-02-00.013834.940001.97922
Palladium (Pd)7440-05-30.000810.290000.11619
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.18965
Silica fused60676-86-00.2040060.0000029.19040
Flame retardantMetal hydroxideProprietary0.010203.000001.45952
ImpurityBismuth (Bi)7440-69-90.001700.500000.24325
PigmentCarbon black1333-86-40.001700.500000.24325
PolymerEpoxy resin systemProprietary0.023807.000003.40555
Phenolic resinProprietary0.020406.000002.91904
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00159
Tin solderTin (Sn)7440-31-50.0199999.940002.86009
WireImpurityNon hazardousProprietary0.000000.010000.00008
Pure metalGold (Au)7440-57-50.0058699.990000.83785
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.