Chemical content PBSS4021PX

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Type numberPackagePackage descriptionTotal product weight
PBSS4021PXSOT89MPT345.91198 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340634031157126030 s123520 s3Dongguan, China; Bangkok, Thailand; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.62021
PolymerResin systemProprietary0.0502515.000000.10945
DieDoped siliconSilicon (Si)7440-21-31.27000100.000002.76616
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100037.84606
Iron (Fe)7439-89-60.026220.150000.05711
Phosphorus (P)7723-14-00.006990.040000.01523
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15228
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23242
FillerSilica -amorphous-7631-86-90.075480.290000.16439
Silica fused60676-86-022.4214086.1500048.83562
HardenerPhenolic resinProprietary1.116524.290002.43186
PigmentCarbon black1333-86-40.049450.190000.10770
PolymerEpoxy resin systemProprietary2.256458.670004.91474
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00086
Tin solderTin (Sn)7440-31-50.7075899.940001.54116
WireImpurityNon hazardousProprietary0.000010.010000.00002
Pure metalCopper (Cu)7440-50-80.0939799.990000.20466
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.