Chemical content PBSS4032NT

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Type numberPackagePackage descriptionTotal product weight
PBSS4032NTSOT23TO-236AB9.37398 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340627652159126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.32857
PolymerResin systemProprietary0.0092023.000000.09814
DieDoped siliconSilicon (Si)7440-21-30.60000100.000006.40070
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300033.03695
Iron (Fe)7439-89-60.082912.520000.88445
Lead (Pb)7439-92-10.000990.030000.01053
Phosphorus (P)7723-14-00.004940.150000.05265
Zinc (Zn)7440-66-60.006250.190000.06668
Pure metal layerSilver (Ag)7440-22-40.098042.980001.04590
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.22175
FillerSilica -amorphous-7631-86-90.014700.290000.15685
Silica fused60676-86-04.3678086.1500046.59499
HardenerPhenolic resinProprietary0.217504.290002.32028
PigmentCarbon black1333-86-40.009630.190000.10276
PolymerEpoxy resin systemProprietary0.439578.670004.68925
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00207
Tin solderTin (Sn)7440-31-50.3497999.940003.73150
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0239799.990000.25574
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.