Chemical content PBSS4041NT

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Type numberPackagePackage descriptionTotal product weight
PBSS4041NTSOT23TO-236AB9.35542 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93406276321510126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.32922
PolymerResin systemProprietary0.0092023.000000.09834
DieDoped siliconSilicon (Si)7440-21-30.60000100.000006.41339
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300033.10249
Iron (Fe)7439-89-60.082912.520000.88620
Lead (Pb)7439-92-10.000990.030000.01055
Phosphorus (P)7723-14-00.004940.150000.05275
Zinc (Zn)7440-66-60.006250.190000.06682
Pure metal layerSilver (Ag)7440-22-40.098042.980001.04797
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.22219
FillerSilica -amorphous-7631-86-90.014700.290000.15716
Silica fused60676-86-04.3678086.1500046.68743
HardenerPhenolic resinProprietary0.217504.290002.32489
PigmentCarbon black1333-86-40.009630.190000.10297
PolymerEpoxy resin systemProprietary0.439578.670004.69855
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00208
Tin solderTin (Sn)7440-31-50.3497999.940003.73890
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0054299.990000.05798
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.