Chemical content PBSS4130PAN

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Type numberPackagePackage descriptionTotal product weight
PBSS4130PANSOT1118HUSON67.08545 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934066879115612601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01101
FillerSilver (Ag)7440-22-40.0655284.000000.92471
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.11008
Isobornyl Methacrylate7534-94-30.003905.000000.05504
DieDoped siliconSilicon (Si)7440-21-30.24000100.000003.38722
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100036.12205
Magnesium (Mg)7439-95-40.005380.200000.07596
Nickel (Ni)7440-02-00.085303.170001.20394
Silicon (Si)7440-21-30.018570.690000.26206
Pure metal layerGold (Au)7440-57-50.000540.020000.00760
Nickel (Ni)7440-02-00.019910.740000.28105
Palladium (Pd)7440-05-30.001880.070000.02659
Mould CompoundAdditiveNon hazardousProprietary0.015940.410000.22498
FillerSilica -amorphous-7631-86-90.011280.290000.15913
Silica fused60676-86-03.3495186.1500047.27310
HardenerPhenolic resinProprietary0.166804.290002.35405
PigmentCarbon black1333-86-40.007390.190000.10426
PolymerEpoxy resin systemProprietary0.337098.670004.75749
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00128
Tin solderTin (Sn)7440-31-50.1639099.940002.31321
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0244599.990000.34501
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.