Chemical content PBSS4250X

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Type numberPackagePackage descriptionTotal product weight
PBSS4250XSOT89MPT345.04122 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93405796713516126030 s123520 s3D-22529 HAMBURG, Germany; Bangkok, Thailand; Dongguan, China 
93405796711515126030 s123520 s3Bangkok, Thailand; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.63220
PolymerResin systemProprietary0.0502515.000000.11156
DieDoped siliconSilicon (Si)7440-21-30.45000100.000000.99908
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100038.57772
Iron (Fe)7439-89-60.026220.150000.05821
Phosphorus (P)7723-14-00.006990.040000.01552
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15523
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23691
FillerSilica -amorphous-7631-86-90.075480.290000.16757
Silica fused60676-86-022.4214086.1500049.77973
HardenerPhenolic resinProprietary1.116524.290002.47887
PigmentCarbon black1333-86-40.049450.190000.10979
PolymerEpoxy resin systemProprietary2.256458.670005.00975
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00087
Tin solderTin (Sn)7440-31-50.7075899.940001.57095
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0432299.990000.09596
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.