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Chemical content PBSS4360X

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Type numberPackagePackage descriptionTotal product weight
PBSS4360XSOT89MPT345.02930 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660028115512601235D-22529 HAMBURG, Germany; Dongguan, China 
934660028135512601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.63237
PolymerResin systemProprietary0.0502515.000000.11159
subTotal0.33500100.000000.74396
DieDoped siliconSilicon (Si)7440-21-30.44000100.000000.97714
subTotal0.44000100.000000.97714
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100038.58793
Iron (Fe)7439-89-60.026220.150000.05823
Phosphorus (P)7723-14-00.006990.040000.01553
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15527
subTotal17.47900100.0000038.81696
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23697
FillerSilica -amorphous-7631-86-90.075480.290000.16761
Silica fused60676-86-022.4214086.1500049.79291
HardenerPhenolic resinProprietary1.116524.290002.47953
PigmentCarbon black1333-86-40.049450.190000.10982
PolymerEpoxy resin systemProprietary2.256458.670005.01108
subTotal26.02600100.0000057.79792
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00087
Tin solderTin (Sn)7440-31-50.7075899.940001.57137
subTotal0.70800100.000001.57231
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0413099.990000.09171
subTotal0.04130100.000000.09172
total45.02930100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.