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Chemical content PBSS4540Z

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Type numberPackagePackage descriptionTotal product weight
PBSS4540ZSOT223SC-73103.65590 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340554951151412601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1001077.000000.09657
PolymerResin systemProprietary0.0299023.000000.02885
subTotal0.13000100.000000.12542
DieDoped siliconSilicon (Si)7440-21-31.27000100.000001.22521
subTotal1.27000100.000001.22521
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500048.93609
Iron (Fe)7439-89-60.051160.100000.04936
Phosphorus (P)7723-14-00.015350.030000.01481
Pure metal layerSilver (Ag)7440-22-40.368350.720000.35536
subTotal51.16000100.0000049.35562
Mould CompoundAdditiveNon hazardousProprietary1.414912.900001.36501
Triphenylphosphine603-35-00.024400.050000.02353
FillerSilica -amorphous-7631-86-935.1288072.0000033.88982
PigmentCarbon black1333-86-40.024400.050000.02353
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-27.3185015.000007.06038
Phenol Formaldehyde resin (generic)9003-35-44.8790010.000004.70692
subTotal48.79000100.0000047.06919
Post-PlatingImpurityLead (Pb)7439-92-10.000100.004500.00010
Non hazardousProprietary0.001230.055500.00118
Tin solderTin (Sn)7440-31-52.2086799.940002.13077
subTotal2.21000100.000002.13205
WireImpurityNon hazardousProprietary0.000010.010000.00001
Pure metalCopper (Cu)7440-50-80.0958999.990000.09251
subTotal0.09590100.000000.09252
total103.65590100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.