Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5130PAP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5130PAPSOT1118HUSON67.08545 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066881115712601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01101
FillerSilver (Ag)7440-22-40.0655284.000000.92471
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.11008
Isobornyl Methacrylate7534-94-30.003905.000000.05504
subTotal0.07800100.000001.10084
DieDoped siliconSilicon (Si)7440-21-30.24000100.000003.38722
subTotal0.24000100.000003.38722
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100036.12205
Magnesium (Mg)7439-95-40.005380.200000.07596
Nickel (Ni)7440-02-00.085303.170001.20394
Silicon (Si)7440-21-30.018570.690000.26206
Pure metal layerGold (Au)7440-57-50.000540.020000.00760
Nickel (Ni)7440-02-00.019910.740000.28105
Palladium (Pd)7440-05-30.001880.070000.02659
subTotal2.69100100.0000037.97925
Mould CompoundAdditiveNon hazardousProprietary0.015940.410000.22498
FillerSilica -amorphous-7631-86-90.011280.290000.15913
Silica fused60676-86-03.3495186.1500047.27310
HardenerPhenolic resinProprietary0.166804.290002.35405
PigmentCarbon black1333-86-40.007390.190000.10426
PolymerEpoxy resin systemProprietary0.337098.670004.75749
subTotal3.88800100.0000054.87301
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00128
Tin solderTin (Sn)7440-31-50.1639099.940002.31321
subTotal0.16400100.000002.31459
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0244599.990000.34501
subTotal0.02445100.000000.34504
total7.08545100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.