Chemical content PBSS5330PA

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Type numberPackagePackage descriptionTotal product weight
PBSS5330PASOT1061HUSON37.69725 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340642731356126030 s123520 s3Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
9340642731158126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01429
FillerSilver (Ag)7440-22-40.0924084.000001.20043
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14291
Isobornyl Methacrylate7534-94-30.005505.000000.07145
DieDoped siliconSilicon (Si)7440-21-30.32000100.000004.15733
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000034.31574
Magnesium (Mg)7439-95-40.008410.300000.10929
Nickel (Ni)7440-02-00.098143.500001.27500
Silicon (Si)7440-21-30.024390.870000.31693
Pure metal layerGold (Au)7440-57-50.001120.040000.01457
Nickel (Ni)7440-02-00.028041.000000.36429
Palladium (Pd)7440-05-30.002520.090000.03279
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22691
FillerSilica -amorphous-7631-86-90.012350.290000.16050
Silica fused60676-86-03.6699986.1500047.67924
HardenerPhenolic resinProprietary0.182754.290002.37428
PigmentCarbon black1333-86-40.008090.190000.10515
PolymerEpoxy resin systemProprietary0.369348.670004.79836
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00123
Tin solderTin (Sn)7440-31-50.1699099.940002.20726
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0332599.990000.43193
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.