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Chemical content PBSS5330PAS

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Type numberPackagePackage descriptionTotal product weight
PBSS5330PASSOT1061DHUSON37.68691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068107115412601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01431
FillerSilver (Ag)7440-22-40.0924084.000001.20204
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14310
Isobornyl Methacrylate7534-94-30.005505.000000.07155
subTotal0.11000100.000001.43100
DieDoped siliconSilicon (Si)7440-21-30.32000100.000004.16292
subTotal0.32000100.000004.16292
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400034.23058
Magnesium (Mg)7439-95-40.014020.500000.18239
Nickel (Ni)7440-02-00.103753.700001.34967
Silicon (Si)7440-21-30.022430.800000.29182
Pure metal layerGold (Au)7440-57-50.001680.060000.02189
Nickel (Ni)7440-02-00.028041.000000.36478
Palladium (Pd)7440-05-30.002800.100000.03648
subTotal2.80400100.0000036.47761
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22722
FillerSilica -amorphous-7631-86-90.012350.290000.16071
Silica fused60676-86-03.6699986.1500047.74337
HardenerPhenolic resinProprietary0.182754.290002.37747
PigmentCarbon black1333-86-40.008090.190000.10530
PolymerEpoxy resin systemProprietary0.369348.670004.80482
subTotal4.26000100.0000055.41889
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00123
Tin solderTin (Sn)7440-31-50.1699099.940002.21022
subTotal0.17000100.000002.21155
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0229099.990000.29795
subTotal0.02291100.000000.29798
total7.68691100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.