Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5480X

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5480XSOT89MPT345.85698 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934058211146212601235D-22529 HAMBURG, Germany; Dongguan, China 
9340582111351412601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2847585.000000.62095
PolymerResin systemProprietary0.0502515.000000.10958
subTotal0.33500100.000000.73053
DieDoped siliconSilicon (Si)7440-21-31.25000100.000002.72587
subTotal1.25000100.000002.72587
Lead FrameCopper alloyCopper (Cu)7440-50-817.3758799.4100037.89145
Iron (Fe)7439-89-60.026220.150000.05717
Phosphorus (P)7723-14-00.006990.040000.01525
Pure metal layerSilver (Ag)7440-22-40.069920.400000.15247
subTotal17.47900100.0000038.11634
Mould CompoundActive agentNon hazardousProprietary0.106710.410000.23269
FillerSilica -amorphous-7631-86-90.075480.290000.16459
Silica fused60676-86-022.4214086.1500048.89419
HardenerPhenolic resinProprietary1.116524.290002.43478
PigmentCarbon black1333-86-40.049450.190000.10783
PolymerEpoxy resin systemProprietary2.256458.670004.92063
subTotal26.02600100.0000056.75471
Post-PlatingImpurityLead (Pb)7439-92-10.000030.004500.00007
Non hazardousProprietary0.000390.055500.00086
Tin solderTin (Sn)7440-31-50.7075899.940001.54300
subTotal0.70800100.000001.54393
WireImpurityNon hazardousProprietary0.000010.010000.00001
Pure metalCopper (Cu)7440-50-80.0589799.990000.12859
subTotal0.05898100.000000.12860
total45.85698100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.