Chemical content PBSS5520X

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Type number	Package	Package description	Total product weight
PBSS5520X	SOT89	MPT3	45.87698 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934058149135	13	1	260		1	235			Dongguan, China; D-22529 HAMBURG, Germany

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	0.28475	85.00000	0.62068
	Polymer	Resin system	Proprietary	0.05025	15.00000	0.10953
		subTotal		0.33500	100.00000	0.73021

Die	Doped silicon	Silicon (Si)	7440-21-3	1.27000	100.00000	2.76827
		subTotal		1.27000	100.00000	2.76827

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	17.37587	99.41000	37.87493
		Iron (Fe)	7439-89-6	0.02622	0.15000	0.05715
		Phosphorus (P)	7723-14-0	0.00699	0.04000	0.01524
	Pure metal layer	Silver (Ag)	7440-22-4	0.06992	0.40000	0.15240
		subTotal		17.47900	100.00000	38.09972

Mould Compound	Active agent	Non hazardous	Proprietary	0.10671	0.41000	0.23259
	Filler	Silica -amorphous-	7631-86-9	0.07548	0.29000	0.16452
		Silica fused	60676-86-0	22.42140	86.15000	48.87287
	Hardener	Phenolic resin	Proprietary	1.11652	4.29000	2.43372
	Pigment	Carbon black	1333-86-4	0.04945	0.19000	0.10779
	Polymer	Epoxy resin system	Proprietary	2.25645	8.67000	4.91849
		subTotal		26.02600	100.00000	56.72998

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00003	0.00450	0.00007
		Non hazardous	Proprietary	0.00039	0.05550	0.00086
	Tin solder	Tin (Sn)	7440-31-5	0.70758	99.94000	1.54233
		subTotal		0.70800	100.00000	1.54326

Wire	Impurity	Non hazardous	Proprietary	0.00001	0.01000	0.00001
	Pure metal	Copper (Cu)	7440-50-8	0.05897	99.99000	0.12854
		subTotal		0.05898	100.00000	0.12855

		total		45.87698	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.