Chemical content PBSS5560PA

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Type numberPackagePackage descriptionTotal product weight
PBSS5560PASOT1061HUSON38.07845 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340634971156126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01362
FillerSilver (Ag)7440-22-40.0924084.000001.14378
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13616
Isobornyl Methacrylate7534-94-30.005505.000000.06808
DieDoped siliconSilicon (Si)7440-21-30.69000100.000008.54124
Lead FrameCopper alloyCopper (Cu)7440-50-82.6413794.2000032.69647
Magnesium (Mg)7439-95-40.008410.300000.10413
Nickel (Ni)7440-02-00.098143.500001.21484
Silicon (Si)7440-21-30.024390.870000.30197
Pure metal layerGold (Au)7440-57-50.001120.040000.01388
Nickel (Ni)7440-02-00.028041.000000.34710
Palladium (Pd)7440-05-30.002520.090000.03124
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.21620
FillerSilica -amorphous-7631-86-90.012350.290000.15293
Silica fused60676-86-03.6699986.1500045.42938
HardenerPhenolic resinProprietary0.182754.290002.26224
PigmentCarbon black1333-86-40.008090.190000.10019
PolymerEpoxy resin systemProprietary0.369348.670004.57194
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00009
Non hazardousProprietary0.000090.055500.00117
Tin solderTin (Sn)7440-31-50.1699099.940002.10310
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0444599.990000.55017
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.