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Chemical content PBSS8110Z

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Type numberPackagePackage descriptionTotal product weight
PBSS8110ZSOT223SC-73105.53468 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340579771351512601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.11000100.000000.10423
subTotal0.11000100.000000.10423
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500048.06490
Iron (Fe)7439-89-60.051160.100000.04848
Phosphorus (P)7723-14-00.015350.030000.01454
Pure metal layerSilver (Ag)7440-22-40.368350.720000.34903
subTotal51.16000100.0000048.47695
Mould CompoundFillerSilica fused60676-86-039.9682275.1000037.87212
PigmentCarbon black1333-86-40.159660.300000.15129
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-29.3135017.500008.82506
Phenol Formaldehyde resin (generic)9003-35-43.778627.100003.58045
subTotal53.22000100.0000050.42892
Post-PlatingImpurityLead (Pb)7439-92-10.000050.004500.00004
Non hazardousProprietary0.000570.055500.00054
Tin solderTin (Sn)7440-31-51.0193999.940000.96593
subTotal1.02000100.000000.96651
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalCopper (Cu)7440-50-80.0246799.990000.02338
subTotal0.02468100.000000.02338
total105.53468100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.