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Chemical content PBSS9110Z

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Type numberPackagePackage descriptionTotal product weight
PBSS9110ZSOT223SC-73105.80468 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340579781351512601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.38000100.000000.35915
subTotal0.38000100.000000.35915
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500047.94225
Iron (Fe)7439-89-60.051160.100000.04835
Phosphorus (P)7723-14-00.015350.030000.01451
Pure metal layerSilver (Ag)7440-22-40.368350.720000.34814
subTotal51.16000100.0000048.35325
Mould CompoundFillerSilica fused60676-86-039.9682275.1000037.77547
PigmentCarbon black1333-86-40.159660.300000.15090
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-29.3135017.500008.80254
Phenol Formaldehyde resin (generic)9003-35-43.778627.100003.57132
subTotal53.22000100.0000050.30023
Post-PlatingImpurityLead (Pb)7439-92-10.000050.004500.00004
Non hazardousProprietary0.000570.055500.00054
Tin solderTin (Sn)7440-31-51.0193999.940000.96346
subTotal1.02000100.000000.96404
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalCopper (Cu)7440-50-80.0246799.990000.02332
subTotal0.02468100.000000.02332
total105.80468100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.