Chemical content PDTA114EQB-Q

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Type numberPackagePackage descriptionTotal product weight
PDTA114EQB-QSOT8015DFN1110D-31.59400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934663471147212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0053276.000000.33375
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0007310.470000.04598
Phenolic resinProprietary0.0009513.530000.05942
DieDoped siliconSilicon (Si)7440-21-30.02600100.000001.63112
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860045.09452
Magnesium (Mg)7439-95-40.001120.149000.07029
Nickel (Ni)7440-02-00.022422.980901.40630
Silicon (Si)7440-21-30.004860.645900.30472
Pure metal layerGold (Au)7440-57-50.000060.007700.00363
Nickel (Ni)7440-02-00.004470.594000.28023
Palladium (Pd)7440-05-30.000270.036500.01722
Mould CompoundFillerSilica -amorphous-7631-86-90.060017.980003.76472
Silica fused60676-86-00.6022980.0920037.78493
PigmentCarbon black1333-86-40.006980.928000.43780
PolymerEpoxy resin systemProprietary0.063548.450003.98645
Phenolic resinProprietary0.019182.550001.20301
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00016
Non hazardousProprietary0.000030.055500.00198
Tin solderTin (Sn)7440-31-50.0569799.940003.57376
WireImpurityNon hazardousProprietaryNaN0.01000NaN
Pure metalCopper (Cu)7440-50-8NaN99.99000NaN
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.