Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTA123YM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA123YMSOT883XQFN30.865795 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340588233151512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.877806
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.120929
Phenolic resinProprietary0.00135313.5300000.156273
subTotal0.010000100.0000001.155008
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000004.620031
subTotal0.040000100.0000004.620031
Lead FrameCopper alloyCopper (Cu)7440-50-80.40166393.41000046.392391
Magnesium (Mg)7439-95-40.0006280.1460000.072511
Nickel (Ni)7440-02-00.0125262.9130001.446751
Silicon (Si)7440-21-30.0027130.6310000.313388
MetallisationGold (Au)7440-57-50.0001500.0350000.017383
Nickel (Ni)7440-02-00.0118462.7550001.368280
Palladium (Pd)7440-05-30.0004730.1100000.054632
subTotal0.430000100.00000049.665336
Mould CompoundFillerSilica -amorphous-7631-86-90.08510023.0000009.829117
Silica fused60676-86-00.22200060.00000025.641174
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0111003.0000001.282059
Ion trapping agentBismuth (Bi)7440-69-90.0018500.5000000.213676
PigmentCarbon black1333-86-40.0018500.5000000.213676
PolymerEpoxy resin systemProprietary0.0259007.0000002.991470
Phenolic resinProprietary0.0222006.0000002.564117
subTotal0.370000100.00000042.735290
Post-PlatingImpurityLead (Pb)7439-92-10.0000000.0045000.000052
Non hazardousProprietary0.0000060.0555000.000641
Tin solderTin (Sn)7440-31-50.00999499.9400001.154315
subTotal0.010000100.0000001.155008
WireImpurityNon hazardousProprietary0.0000010.0100000.000067
Pure metalGold (Au)7440-57-50.00579499.9900000.669260
subTotal0.005795100.0000000.669327
total0.865795100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.